FREMONT, Calif., April 10, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging applications, today announced that its Ultra ECP ap-p tool has won the 2025 3D InCites Award in the Technology Enablement category. This award honors companies that have identified and solved critical challenges in the advancement of the heterogeneous integration roadmap, driving the industry forward through cutting-edge solutions and advancements.
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