Highlights:
FREUDENSTADT, Germany, May 28, 2024 (GLOBE NEWSWIRE) -- Today, SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.
Read more at globenewswire.com